Houdt Van | Imec
スポンサーリンク
概要
Imec | 論文
- 24pWK-6 電圧印加によるGaAs(100)/Fe/Au/Feの交換結合変化(24pWK 薄膜・人工格子磁性,表面・界面磁性,領域3(磁性,磁気共鳴))
- Architectural Exploration and Design of Time-Interleaved SAR Arrays for Low-Power and High Speed A/D Converters
- Architectural Exploration and Design of Time-Interleaved SAR Arrays for Low-Power and High Speed A/D Converters
- A Low-Power Reduced Kick-Back Comparator with Improved Calibration for High-Speed Flash ADCs
- 三次元積層LSIチップにおける基板ノイズの層間評価(3次元集積,低電圧/低消費電力技術,新デバイス・回路とその応用)