Sorooshian J | Department Of Chemical And Environmental Engineering University Of Arizona
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概要
Department Of Chemical And Environmental Engineering University Of Arizona | 論文
- Frictional and Removal Rate Studies of Silicon Dioxide and Silicon Nitride CMP Using Novel Cerium Dioxide Abrasive Slurries
- Characterization of Pad–Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy
- Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces
- Analysis of Formation of Pad Stains in Copper Chemical Mechanical Planarization
- Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process