ZHUANG Yun | Araca, Inc.
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概要
Araca, Inc. | 論文
- 高精度CMP終点検出方法の検討(プロセス科学と新プロセス技術)
- Tribological study for low shear force CMP process on damascene interconnects (シリコン材料・デバイス)
- Theoretical and Experimental Investigation of Conditioner Design Factors on Tribology and Removal Rate in Copper Chemical Mechanical Planarization
- Characterization of Pad–Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy
- Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces