高野 力 | 長瀬産業 (株) コダック製品事業部
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概要
論文 | ランダム
- Enhancement of Etch Rate by the Addition of O_2 and Ar in Chemical Dry Etching of Si Using a Discharge Flow of Ar/CF_4 and CF_4/O_2 Gas Mixtures
- Downflow Etching of Si Using a Microwave-Excited Discharge Plasma of Ar/CF_4 Mixtures
- An Efficient Decomposition of NO into N_2 and O_2 in a Fast Discharge Flow of NO/He Mixtures
- Chemical Dry Etching of Si Substrate in a Discharge Flow Using Ar/CF_4 Gas Mixtures
- Surface of Bi_2Sr_2CaCu_2O_y Single Crystals Heated in Air