Lee Chi-Ming | Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences
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Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences | 論文
- Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface
- Effect of Phase Formation Behavior on Thermal Stability of Hafnium-Based Thin Films for Copper Interconnects
- Effect of Phase Formation Behavior on Thermal Stability of Hafnium-Based Thin Films for Copper Interconnects
- Topology Optimal Compliant Microgripper
- New Non-Lyapunov Approach to Robust Eigenvalue-Clustering Analysis