LEE Jang-Sik | 論文著者

Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang, Gyeongbuk 790-784, Korea

Division Of Materials Science And Engineering College Of Engineering Seoul National University

Division of Materials Science and Engineering, College of Engineering, Seoul National University

School Of Materials Science & Engineering College Of Engineering Seoul National University

School of Materials Science & Engineering, College of Engineering, Seoul National University

School of Materials Science & Engineering, College of Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-ku, Seoul 151-742, Korea

School Of Materials Science And Engineering College Of Engineering Seoul National University

School Of Materials Science And Engineering College Of Enginering Seoul National University

School of Materials Science and Engineering, College of Engineering, Seoul National University

School of Materials Science and Engineering, College of Enginering, Seoul National University

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd

Technology Development Team Semiconductor R&d Center Memory Business Samsung Electronics Co. Ltd