Increased Interfacial Strength at Microscale Silicon--Polymer Interface by Nanowires Assisted Micro-Sandglass Shaped Interlocks

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概要

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• We present an interfacial strengthening technique for microsystem packaging, particularly at the interface of stiff and soft materials. Micro-sandglass shaped interlocks (MSIs) were first demonstrated at the interface of silicon and Nafion® and exhibited a strong interfacial strength of 1 MPa; moreover, nanowired micro-sandglass shaped interlocks (NW-MSIs) were employed to further enhance the interfacial strength, and a value of 3.4 MPa was achieved. Theoretical predictions indicated the enhancement factors include the gap shrinkage ratio, overhanging angle, contact area, and friction coefficient. The geometry of the MSIs is strongly dependent on the KOH etching time while the friction can be enhanced by the employment of nanowires on the sidewalls of MSIs. Based on the NW-MSIs, the highest interfacial strength obtained is 3.4-fold higher than that of MSIs without nanowires.

• 2012-02-25

著者

• Peng Hsien-Chih

  Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan 30013, R.O.C.

• Khoo Hwa

  Institut de Science et d'Ingénierie Supramoléculaires (ISIS), Université de Strasbourg, CNRS UMR 7006, No. 8, allée Gaspard Monge, 67083 Strasbourg Cedex, France

• Tseng Fan-Gang

  Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan 30013, R.O.C.

• Khoo Hwa

  Institut de Science et d'Ingénierie Supramoléculaires (ISIS), Université de Strasbourg, CNRS UMR 7006, No. 8, allée Gaspard Monge, 67083 Strasbourg Cedex, France

関連論文

• Increased Interfacial Strength at Microscale Silicon--Polymer Interface by Nanowires Assisted Micro-Sandglass Shaped Interlocks

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