Design and Fabrication of Highly Manufacturable Microelectromechanical Systems Test Sockets for Ball Grid Array Integrated Circuit Packages

スポンサーリンク

概要

• 論文の詳細を見る

• We have developed two types of microelectromechanical systems (MEMS) test sockets for the ball grid array (BGA) integrated circuit (IC) packages. The fabricated MEMS test sockets have simple structures, easy fabrication processes, low contact forces, and rapid prototyping and cost-effective processes. In the case of the cantilever-array-type test socket, we optimized the length, width, and thickness of the cantilever appropriate for a 121 ball square BGA IC package test. The contact force is 1.3 mN (1 g force \approx 1 mN) for each cantilever with a length of 425 μm, a width of 150 μm, and a thickness of 10 μm at a deflection of 100 μm. The mesh-type test socket has a different maximum deflection value in accordance with the contact position. The average contact resistance is 0.73 \Omega and the maximum signal path resistance is 18 \Omega for the two types of MEMS test sockets. The fabricated MEMS test sockets are suitable for an actual BGA IC package test.

• 2011-06-25

著者

• Kim Sangwon

  School of Bioresource Sciences, Andong National University

• Kong Daeyoung

  School of Electrical Engineering and Computer Science, Kyungpook National University, Daegu 702-701, Korea

• Kim Bonghwan

  Department of Electronics Engineering, Catholic University of Daegu, Gyeongsan, Gyeongbuk 712-702, Korea

• Cho Chanseob

  School of Electrical Engineering, Kyungpook National University, Sangju, Gyeongbuk 742-711, Korea

• Nam Jaewoo

  CoreMEMS Inc., Milpitas, CA 95035, U.S.A.

• Lee Jonghyun

  School of Electrical Engineering and Computer Science, Kyungpook National University, Daegu 702-701, Korea

• Kim Sangwon

  School of Electrical Engineering and Computer Science, Kyungpook National University, Daegu 702-701, Korea

関連論文

• Seasonal occurrence pattern and within-plant egg distribution of bean bug, Riptortus pedestris (Fabricius) (Hemiptera: Alydidae), and its egg parasitoids in soybean fields
• Design and Fabrication of Highly Manufacturable Microelectromechanical Systems Test Sockets for Ball Grid Array Integrated Circuit Packages
• An Electrostatically Driven Double-Sided One-Chamber Peristaltic Pump with Four Electrodes
• An Electrostatically Driven Double-Sided One-Chamber Peristaltic Pump with Four Electrodes (Special Issue : Microprocesses and Nanotechnology)

スポンサーリンク