Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System

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概要

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• In this study, the substrate shape effect on the Cu substrates for Sn whisker growth has been investigated. A Cu foil, as a substrate, was bent to 90° by a universal testing machine. The matte Sn layers were electroplated on the Cu substrate under various current densities. Then, the samples were given heat treatment under various temperatures for 250 h. The results indicate that Sn whisker growth was promoted by the compression stress on the concave side and was restrained by the tension stress on the convex side. The increase of plating thickness in electroplating process offered the extensive residual stress to mitigate the Sn whisker growth. Increasing the aging temperatures also enhanced the thickness of the oxide layer. Thick oxide layers can prevent Sn whisker growth.

• 2011-01-25

著者

• Yen Yee-Wen

  Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan

• Tsou Meng-Yu

  Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan

• Shao Pei-Sheng

  Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan

• Li Chao-Kang

  Graduate Institute of Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan

関連論文

• Substrate Shape Effect on the Sn Whisker Growth in the Electroplating Matte Sn System

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