Effects of Excimer Irradiation Treatment on Thermocompression Au–Au Bonding

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概要

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• We studied the feasibility of using vacuum ultraviolet (VUV) treatment as a surface improvement technique with Au–Au flip-chip bonding. For fine-pitch electrical interconnections in three-dimensional (3D) stack applications, robust and reliable bonding is desirable; in this case, surface modification treatment is needed before the bonding process. A VUV surface treatment was used to remove organic contaminants. Samples of electroplated Au pads were examined by X-ray photoelectron spectroscopy (XPS) to evaluate the chemical composition of the Au surfaces. The XPS results revealed that the carbon-based contaminants on the surface were removed by the VUV treatment. The shear strength of the bonded sample was also improved. The average shear strength of a bump with VUV treatment is 1.6 times larger than that of a bump without VUV treatment. Cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. The results show that VUV treatment has clear effects on Au–Au flip-chip bonding.

• 2010-06-25

著者

• MIZUNO Jun

  Nano-technology Research Laboratory, Waseda University

• Katsuyuki Sakuma

  Nano-Science and Nano-Engineering Department, Waseda University, Shinjuku, Tokyo 169-8555, Japan

• Shuichi Shoji

  Nano-Science and Nano-Engineering Department, Waseda University, Shinjuku, Tokyo 169-8555, Japan

• Jun Mizuno

  Nano-Science and Nano-Engineering Department, Waseda University, Shinjuku, Tokyo 169-8555, Japan

• Unami Naoko

  Nano-Science and Nano-Engineering Department, Waseda University, Shinjuku, Tokyo 169-8555, Japan

• Sakuma Katsuyuki

  Nano-Science and Nano-Engineering Department, Waseda University, Shinjuku, Tokyo 169-8555, Japan

• Naoko Unami

  Nano-Science and Nano-Engineering Department, Waseda University, Shinjuku, Tokyo 169-8555, Japan

関連論文

• Low-temperature Direct Bonding of Poly(methyl methacrylate) for Polymer Microchips
• Effects of Excimer Irradiation Treatment on Thermocompression Au–Au Bonding

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