High Coplanarity and Fine Pitch Copper Pillar Bumps Fabrication Method
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概要
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In this paper, we report a novel plating-friendly polishing mechanism for fabrication of high coplanarity and high density lead-free copper pillar bumps for advanced packaging applications. The final experimental results showed that the uniformity in wafer (UIW) could be sharply improved from 4.31% after plating to 2.88% after polishing and even to 2.54% after reflow throughout the entire 4 inch wafer.
- 2010-06-25
著者
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Kuo-Yu Lee
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan
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Ting-Chiang Tsai
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan
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Ching-Kong Chen
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan
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Jung-Tang Huang
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan
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Huang Jung-Tang
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan
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Hsu Hou-Jun
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan
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Lee Kuo-Yu
Institute of Mechanical and Electrical Engineering, National Taipei University of Technology, 1, Sec. 3, Chung Hsiao E. Rd, Taipei 106, Taiwan