Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging

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概要

• 論文の詳細を見る

• The effect of conditioner aggressiveness is investigated in interlayer dielectric polishing on three types of pad. A method using confocal microscopy is used to analyze the effect of conditioner aggressiveness on pad–wafer contact. Results show that a more aggressive conditioner produces a higher interlayer dielectric polishing rate while at the same time a pad surface with fewer contacting summits and less contact area. It is found that the ratio of the contacting summit density to the contact area fraction is more important than either parameter measured separately since the ratio determines the mean real contact pressure. Modeling results based on contact area measurements agree well with experimental results. Moreover, it is found that a more aggressive disc also generates a thicker slurry film at the pad–wafer interface. This is in agreement with our general findings regarding pad asperity height distribution obtained using confocal microscopy.

• 2010-02-25

著者

• Ara Philipossian

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Ting Sun

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Yun Zhuang

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Len Borucki

  Araca Incorporated, Tucson, AZ 85750, U.S.A.

• Yasa Sampurno

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Fransisca Sudargho

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Xiaomin Wei

  Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721, U.S.A.

• Sriram Anjur

  Cabot Microelectronics Corp., Aurora, IL 60504, U.S.A.

関連論文

• Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging
• Characterization of Pad–Wafer Contact and Surface Topography in Chemical Mechanical Planarization Using Laser Confocal Microscopy
• Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces

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