Nanoscale Selective Plasma Etching of Ultrathin HfO2 Layers on GaAs for Advanced Complementary Metal–Oxide–Semiconductor Devices

概要

論文の詳細を見る
We present a reliable dry-etch process for patterning deep-submicron structures in ultrathin (16 nm) HfO2 layers deposited on GaAs substrates. Plasma chemistries based on BCl3/O2 and SF6/Ar have been investigated using an inductively-coupled plasma reactive ion etch (ICP-RIE) reactor. The process reliability has been examined in terms of etch rate selectivity, etch time control, anisotropy, and surface roughness of the underlying GaAs substrate for potential application to gate nanopatterning in next-generation field-effect transistor fabrication. We show that a SF6/Ar plasma process provides excellent prospects as a nanopatterning method for subsequent re-growth of GaAs in novel device architectures.
2010-10-25