A Binder-Free Ag Paste Using a Chemically Adsorbed Monolayer
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概要
- 論文の詳細を見る
We developed a binder-free Ag paste using reactive chemically absorbed monolayers (CAMs), such as epoxy-terminated CAMs. Ag paste was prepared by forming an epoxy-terminated CAM with 2-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane (ECHxES) on the surface of Ag particles, followed by adding 2-methyl-imidazole (2-MeIm) as a cross-linker into a suspension of dispersed Ag particles modified with ECHxES. To increase electrical conductivity, a mixture of large (average diameter $D = 1.0$ μm) and small ($D = 0.5$ μm) Ag particles was used. When the ratio in the mixture of large: small was $7:3$, the best conductivity, $4.0 \times 10^{4}$ S/cm, was obtained. To prepare rigid wires from Ag paste, a cross-linker of a copper imidazole complex, instead of 2-MeIm, was added to the mixture of the Ag particles covered with ECHxES CAMs. The best pencil hardness and the best electrical conductivity obtained with the Ag paste wire were F and $2.5 \times 10^{5}$ S/cm, respectively, which exceeded the values of commercially available Ag pastes.
- 2009-06-25
著者
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Ogawa Kazufumi
Department Of Advanced Materials Science Faculty Of Engineering Kagawa University
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Ohkubo Yuji
Department Of Advanced Materials Science Graduate School Of Engineering Kagawa University
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Onishi Shogo
Department Of Advanced Materials Science Graduate School Of Engineering Kagawa University
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Ogawa Kazufumi
Department of Advanced Materials Science, Graduate School of Engineering, Kagawa University, 2217-20 Hayashi-cho, Takamatsu 761-0396, Japan
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Soejima Kazuhiro
Business Development HQ Process Technology Development Center, ALPS Electric Co., Ltd., 3-31 Akedori, Izumi-ku, Sendai 981-3280, Japan
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Ohkubo Yuji
Department of Advanced Materials Science, Graduate School of Engineering, Kagawa University, 2217-20 Hayashi-cho, Takamatsu 761-0396, Japan
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Onishi Shogo
Department of Advanced Materials Science, Graduate School of Engineering, Kagawa University, 2217-20 Hayashi-cho, Takamatsu 761-0396, Japan
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