Conventional Printed Circuit Board Technology Approach for an Electro-Optical Layer
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概要
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We have fabricated the electro-optical layer where the optical waveguide with 45° mirror plane was formed on Cu side of the flexible copper clad laminate (FCCL) using conventional printed circuit board (PCB) technologies such as vacuum lamination, UV exposure, development and CO2 laser machining. These techniques are expected to give a low cost platform solution for the optical interconnection module in mobile phone applications.
- 2009-06-25
著者
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Cho Han
Advanced Technology Team, Advanced Circuit Interconnection Division, Samsung Electro-Mechanics Co., Ltd., 314 Maetan 3-dong, Yeongtong-gu, Suwon, Gyunggi-do 443-743, Republic of Korea
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Kim Sang-Hoon
Advanced Technology Team, Advanced Circuit Interconnection Division, Samsung Electro-Mechanics Co., Ltd., 314 Maetan 3-dong, Yeongtong-gu, Suwon, Gyunggi-do 443-743, Republic of Korea
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Kim Joon-Sung
Advanced Technology Team, Advanced Circuit Interconnection Division, Samsung Electro-Mechanics Co., Ltd., 314 Maetan 3-dong, Yeongtong-gu, Suwon, Gyunggi-do 443-743, Republic of Korea
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Jung Jaehyun
Advanced Technology Team, Advanced Circuit Interconnection Division, Samsung Electro-Mechanics Co., Ltd., 314 Maetan 3-dong, Yeongtong-gu, Suwon, Gyunggi-do 443-743, Republic of Korea