A High-Throughput Screening System for Thermoelectric Material Exploration Based on a Combinatorial Film Approach
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概要
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A high-throughput system that consists of a combinatorial tool (a sputtering deposition tool and a pulsed laser deposition tool) and two developed property screening devices was used for thermoelectric material exploration. The thermoelectric power factor ($S^{2}\sigma$, $S$ = Seebeck coefficient, $\sigma$ = electrical conductivity) screening device allows us to measure electrical conductivity and Seebeck coefficient of over 1000 sample-points within 6 h. The thermal effusivity measurement system using the frequency domain thermoreflectance technique allows us to screen thermal conductivity of combinatorial/conventional films. Illustrations of these applications are provided with a Co–Sn–Ce/Si(100) film for power factor determination and with a Ba2YCu3O7/SrTiO3(100) film for thermal conductivity derivation.
- 2009-05-25
著者
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Wong-Ng Winnie
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Green Martin
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Chang Kao-Shuo
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Otani Makoto
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Thomas Evan
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Schenck Peter
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Lowhorn Nathan
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.
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Ohguchi Hiroyuki
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, U.S.A.