Hybrid Sub-Resolution Assisting Feature Implementation Methodology by Process Window Aware Optical Proximity Correction Model

概要

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Driven by steadily decreasing critical dimensions in the semiconductor technology, sub-resolution assisting feature (SRAF) has been proposed to enlarge the capability of the exposure technique to smaller pitch requirements exceeding the standard lithography specification by improving the through-focus process window. There are generally two types of SRAF implementation methodologies: the rule-based approach and the model-based approach. In this paper, the hybrid SRAF implementation methodology is proposed to benefit from these two methodologies. Firstly, the candidate rules are selected by using the process window aware optical proximity correction (OPC) model. Secondly, the candidate SRAF rules are taped out. Finally, the optimized candidates among the taped out SRAF rules are verified by wafer data. If the wafer data show that the SRAF rule will not meet the criteria, the SRAF implementation methodology will go back to evaluate other candidates. From the wafer data, it is proved that the hybrid SRAF implementation methodology can achieve an optimized through-focus process window in a short turn around time (TAT) with lower engineering and mask cost.
2009-03-25