Resist Flow Behavior in Ultraviolet Nanoimprint Lithography as a Function of Contact Angle with Stamp and Substrate
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概要
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This study was performed to investigate dynamic resist filling in ultraviolet nanoimprint lithography. The effects of surface condition on flow behavior during the filling process, including the contact angle and the aspect ratio of recessed features, are presented through numerical simulations. The optimized surface conditions for good imprinting results were determined through numerical experiments covering a range of test conditions. A decrease in the feature aspect ratio of up to 0.5 resulted in a contact angle twice the original value. Complete filling occurred when the contact angle of the vertical side wall was as low as that of the substrate.
- 2008-11-25
著者
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Jeong Jun-ho
Intelligent And Precision Machinery Research Division Korea Institute Of Machinery And Materials
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Kim Ki-don
Intelligent And Precision Machinery Research Division Korea Institute Of Machinery And Materials
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Lee Eung-sug
Intelligence And Precision Machinery Research Division Korea Institute Of Machinery & Materials(
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Lee Eung-sug
Intelligent and Precision Machinery Research Division, Korea Institute of Machinery and Materials, 171 Jang-dong, Yuseong-gu, Daejeon 305-343, Korea
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Kwon Hyo-Joong
ADP Engineering Co., Ltd., 333-5 Sangdaewon-dong, Joongwon-gu, Seongnam, Gyeonggi-do 462-807, Korea
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Choi Dae-guen
Intelligent and Precision Machinery Research Division, Korea Institute of Machinery and Materials, 171 Jang-dong, Yuseong-gu, Daejeon 305-343, Korea
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- Resist Flow Behavior in Ultraviolet Nanoimprint Lithography as a Function of Contact Angle with Stamp and Substrate
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