Hole Drilling of Glass Substrates with a CO2 Laser

概要

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A technique for hole drilling of glass substrates with a pulsed CO2 laser has been developed. With respect to laser machinability, we have compared three application in glass substrates, synthetic quartz, Pyrex glass and soda lime glass for single-laser-pulse (SLP) drilling. Although the drilling speeds for each glass are similar, there is a difference in the occurrence of the pileup around the hole, and we have determined that synthetic quartz is excellent for laser processing. Moreover, we have examined hole processing of synthetic quartz substrates by single and multiple-laser-pulse (MLP) drilling. Consequently, by the MLP hole-shaping technique, we can control the taper angle of a through hole, and decrease the height coefficient of the pileup around the hole in synthetic quartz, which is not possible in SLP drilling.
2003-05-15