Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

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概要

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• There can be two kinds of de-bonding options in the aspect of the releasing interface, one is carrier release and the other is device wafer release. Thermoplastic adhesives are used in most cases for carrier release because the materials can easily be cleaned by solvent. On the other hand, device wafer release is usually selected for thermoset adhesives, which is difficult to remove by solvent.

著者

• Lutter Stefan

  Bonder Division, SUSS MicroTec Lithography GmbH, A SUSS MicroTec AG Company

• Ishida Hiroyuki

  Bonder Division, SUSS MicroTec KK

関連論文

• Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

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