高温度こうばい下で一方向凝固したCu-Sn合金のデンドライト成長

概要

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Cu-5wt%Sn alloy was unidirectionally solidified at high temperature gradients up to 350°C/cm in a steady state manner. Dendrite tip radii estimated from the diameter of primary stems are in good agreement with those theoretically predicted basing on the interfacial stability. The dependence of primary and secondary dendrite arm spacings on growth rate and cooling rate was also examined. The dendrite spacing depends on the cooling rate nealy in the same manner in the non-steady state directional solidification.
Japan Foundry Engineering Societyの論文