Transient Heat Transfer of the Microprocessor System Investigation Regarding Natural Convection with Slate Style Chassis
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概要
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This paper explores system level transient heat transfer behavior under natural convection cooling with slate style chassis assuming a tablet device design. Steady state analysis based on heat conduction simulation is conducted to see the effect on microprocessor silicon die temperature and skin temperature of the chassis by internal structure difference and determine final configuration for transient simulation. After that, transient state analysis is conducted assuming the case that a microprocessor starts running TDP (Thermal Design Power) equivalent application workload after system reaches steady state with static screen idle power consumed by the microprocessor.
- The Japan Institute of Electronics Packagingの論文
The Japan Institute of Electronics Packaging | 論文
- 特集に寄せて
- 明星大学連携研究センター大塚研究室
- 徳島文理大学理工学部電子情報工学科多田研究室
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