Ａｌ‐１％Ｍｇ２Ｓｉ合金の４４８Ｋ等温時効挙動に及ぼす室温予備時効と銅添加の影響
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Fixing the room temperature pre-aging for 86.4 ks (RTP) and the temperature of isothermal final aging at 448 K, double aging behavior of Al-1.0%Mg2Si-0∼0.72%Cu alloys was investigated by resistometry and tensile test. Specimens were water quenched after solution treatment at 848 K for 3.6 ks (STQ), aged, measured resistivity at 77 K (ρD77) and then tensile tested. The Cu addition suppressed ρD77 increment by room temperature aging until about 20 ks, whereas in later stage Cu enhanced the increment. After the RTP, proof stress (σ0.2) increased slightly with Cu addition. Similarly as previously reported 473 K aging, the Cu addition accelerated hardening by single 448 K aging after the STQ, enhanced the ρD77 increment in early stage and lowered the ρD77 decrement in peak hardening (448 K-259 ks) state. Though in the base (no Cu) alloy the RTP gave a larger σ0.2 in an assumed bake hardening (B.H.: 448 K-1.2 ks) state of car body, the RTP lowered the B.H. of Cu added alloys. 448 K isothermal age-hardening of no RTP specimens exceeded that after the RTP. The aging time corresponding to cross point of age-hardening curves of no and with the RTP specimens became shorter with Cu addition than the assumed B.H. time, 1.2 ks. However, on the peak hardening state by the final aging, the RTP had no effect, and σ0.2 of both specimens nearly coincided with each together. Until peak hardening, i.e. during the period in which σ0.2 of the no RTP specimens exceeded that of the specimens with RTP, ρD77 of the latter was higher than the former. It is evident from these observations that a part of the RTP products, clusters or zones, or some precipitates changed from them at 448 K, survive until the peak hardening state and result the negative effect of pre-aging famous in 6000 series alloys.
- 一般社団法人 軽金属学会の論文
一般社団法人 軽金属学会 | 論文
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