携帯電話ＰＡ用インピーダンス整合器への適用を目的としたＣｏＦｅＢ／ポリイミドハイブリッド薄膜コプレーナ線路の低損失化

概要

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Suppression of the insertion loss of a CoFeB/polyimide hybrid thin-film coplanar line for impedance matching in a mobile phone power amplifier module was investigated. To suppress the insertion loss of the CoFeB/polyimide hybrid coplanar line, various techniques were investigated on the basis of device simulations and fabrication. As a result, it was found that the introduction of a thick copper signal line, a multilayer magnetic film structure and optimum width of the magnetic film were effective for lowering insertion loss. Insertion loss per quarter wavelength of the fabricated devices was below 0.5 dB in the frequency range from 1 to 1.5 GHz.
社団法人日本磁気学会の論文