Sn-8Zn-3BiはんだとNi/Auめっき電極を用いたCSP接合部の界面組織と接合信頼性
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概要
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In order to investigate the use of Sn-8Zn-3Bi solder as a potential substitute for Sn-Pb solder, which has lower melting point than Sn-Ag family solder, we studied interfacial microstructure and mechanical properties of CSP joints with various thickness of Au and Ni plated on Cu pad compared with Cu pad. Joint strength and other mechanical properties were evaluated in relation to reflow peak temperature. The combination of Au plating thickness of 0.05 μm and reflow peak temperature of 498 K resulted in the best joint reliability both as soldered and after aging treatment. The joint had thin Ni3Sn4 type interfacial reaction layer that included Cu and Zn between the solder and the Ni plating. This interfacial microstructure caused to improve the joint strength.
- The Japan Institute of Metals and Materialsの論文
The Japan Institute of Metals and Materials | 論文
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