Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni
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概要
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The interfacial reactions and the interface microstructures between Sn-3.5Ag-(0.7Cu) lead-free solders and Fe-42Ni substrate were investigated at the reaction temperature of 250°C. Joint strength was also evaluated. The Sn-3.5Ag joint shows the double reaction layers of FeSn<SUB>2</SUB>. Ni from Fe-42Ni dissolves into molten Sn-3.5Ag solder during soldering and forms Ni<SUB>3</SUB>Sn<SUB>4</SUB> compounds with the eutectic network of Ag<SUB>3</SUB>Sn/β-Sn in solder layer during solidification. For the Sn-3.5Ag-0.7Cu jont, the Cu addition in Sn-3.5Ag changes the microstructure of solder and interfacial reaction layers. Ni dissolved into solder melt reacts with Sn and Cu to form a η-phase of Cu-Ni-Sn compound during the soldering without the formations of Ni<SUB>3</SUB>Sn<SUB>4</SUB> compound. At the reaction interface, fine particles of FeSn<SUB>2</SUB> can be found near to the reaction layer instead of the faceted compound of FeSn<SUB>2</SUB> in the second reaction layer for the Sn-Ag joint. Sn-3.5Ag-0.7Cu joint increases the joint strength by about 30—40 MPa higher than that of Sn-3.5Ag joints.
- The Japan Institute of Metals and Materialsの論文
The Japan Institute of Metals and Materials | 論文
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