Copper Electroplating for Via-Hole and Through-Hole Co-Existed Circuit Boards.

概要

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Through-hole plating and via-filling are studied by using the through-holes and via-holes coexisted circuit boards. The effect of additives on the reaction of copper deposition is also studied by using the electrochemical techniques. Conformal plating for through-holes and via-filling are accomplished by electrodeposition with high current density at the initial stage, or intermittently cut off of the current during electroplating. It is considered that selective adsorption of additives on the corner part of through-holes and via-holes are an important factor for conformal plating and via-filling. Effect of additives on copper deposition is greatly influenced by the applied high current density, or cut off interval of the current during electroplating. In addition, suppression effect of copper deposition derived from adsorption of PEG during the cut off of the current is depended on the molecular weight of PEG and the presence of chloride ions.
社団法人エレクトロニクス実装学会の論文