Fluxless Joining of PWB and FPC Using Thermoplastic FPC.
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概要
- 論文の詳細を見る
Electronics products are becoming smaller these days. The connection technology with fine pitch electrodes are very important. We already developed the new method for connecting FPC (Flexible Printed Circuit) and PWB (Printed Wiring Board) . In the new method the volume expansion energy of alkane boiling was used instead of flux. There were no detectable insulation deterioration between the fine pitch electrodes. This paper presented the simultaneous adhesion and encapsulation technology at alkane soldering. When alkane was spread on PWB, and PEI (Poly Ether Imide) FPC was heated by heating tool on the PWB, the adhesion, encapsulation and soldering simultaneously was completed.
- 社団法人 エレクトロニクス実装学会の論文