Effects of Adhesive Layers on Residual Stress Generated in Copper Foil of Copper Clad Laminates
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概要
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This study examined the effects of multi-ply adhesive and an insulating layer on the residual stress generated in the copper foil portions of a copper clad laminate composed of copper foil/FRP/copper foil. First, copper clad laminates were formed by the hot press method using various multi-ply adhesives as well as various insulating layers. Then, residual stress in the copper foil portions of these samples was measured by the strain gauge method of the layer-removing. The thermal and mechanical properties of the multi-ply adhesive and the insulating layer were measured, and the residual stress of the copper foil portion was analyzed together with these various proper-ties. The following results were identified:<BR>(1) The residual stress generated in the copper foil portion depends more on the coefficient of linear expansion of the mirror plate, multi-ply adhesive, and insulating layer than on that of the copper foil. And, it grows hereafter in order of (I) < (II) < (III) .<BR>(I) α<SUB>P</SUB>=α<SUB>A</SUB>=α<SUB>F</SUB><BR>(II) α<SUB>F</SUB><α<SUB>P</SUB><α<SUB>A</SUB> or α<SUB>A</SUB><α<SUB>P</SUB><α<SUB>F</SUB><BR>(III) α<SUB>P</SUB><α<SUB>F</SUB><<SUB>A</SUB> or α<SUB>P</SUB><α<SUB>A</SUB><α<SUB>F</SUB>, α<SUB>F</SUB><α<SUB>A</SUB><α<SUB>P</SUB> or α<SUB>A</SUB><α<SUB>F</SUB><<SUB>P</SUB><BR>Where, α<SUB>P</SUB>: coefficient of linear expansion of mirror plate, α<SUB>A</SUB>: coefficient of linear expansion of adhesive, α<SUB>F</SUB>: . coefficient of linear expansion of insulating layer.<BR>(2) The residual stress generated in the copper foil portion can be reduced by controlling the coefficient of linear expansion of the multi-ply adhesive.
- 社団法人 エレクトロニクス実装学会の論文