Thermal Fatigue Life of Through-hole Soldered Joints on Printed Circuit Boards.
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概要
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This research evaluated the reliability for through-hole joints of pin-type electronic components on printed circuit boards against thermal cycle tests. A variety of factors affecting the crack propagation in free-pin was pointed out, showing the means to decrease the crack growth. Major factors of the crack propagation in through-hole joints are bending strain (εb) caused by the difference in thermal expansion between the connecter board and the printed circuit board in a direction parallel to the board surface, and shearing strain (γ) due to the difference in thermal expansion between the printed circuit boards and the pins in a direction perpendicular to the board surface.The rate of crack propagation in through-hole joints is observed to decrease exponentially with the crack propagation length, probably because the pin movement is restricted by the wall of the through-hole.
- 社団法人 エレクトロニクス実装学会の論文