Measurement of the solid-liquid interface positions of aluminum and aluminum alloys using ultrasonic wave and acoustic emission.
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概要
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The measurement of the solid-liquid interface positions during the unidirectional solidification of aluminum and aluminum-copper alloys was tried using ultrasonic wave and acoustic emission on solidification. For pure aluminum and aluminum-copper eutectic alloy, each of which had planner: interfaces in unidirectional solidification, it was possible to determine the interface positions by measuring the time delay of the reflected sound wave from the interface to a certain surface of specimens. For aluminum-4.5% copper alloy, no reflection of sound wave from interface region could be observed, thus the determination of interface position was impossible. Acoustic emission was clearly observed when the solidification front reached to the wave guides inserted into the specimen. With this acoustic emission, interface positions could be easily determined in spite of the variations of the interface morphology of tested alloys.
- 一般社団法人 軽金属学会の論文
一般社団法人 軽金属学会 | 論文
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