Effect of Cu Addition on Properties of Sn-Ag Lead Free Solder.
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概要
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Effect of Cu addition on melting point, microstructure, wettability and peel strength between Sn-3.5mass%Ag solder and Au coated leadframe has been examined. The melting point was decreased to 218°C by Cu addition. Large Cu<SUB>6</SUB>Sn<SUB>5</SUB> was preticipated in solders at 1.5mass% Cu addition. Wettability was good at 0.5mass% Cu addition. Peel strength was improved by 1.5mass% Cu addition due to the decrease in AuSn<SUB>4</SUB> in the solder.
- 社団法人 エレクトロニクス実装学会の論文