Prediction of Life Temperature for Poly (urethane-amide) and Poly (urethane-imide) in Long-time Use

概要

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Thermal stability of polyurethane (PU) have been improved by incorporating polyamide (PA) or poly-imide (PI). The PU-PI (PA) various reactant ratio were analyzed by means of TG-DTG. The heating rate were 10, 20 and 40°C /min, and temperature range was 25-800°C. Thermal decomposition behavior was studied by Ozawa's analysis method of TG-DTG curves. The quantitative relation between weight loss ratio and the reactant ratio was found. The thermal-resistance increased with the increase of the PA or PI content. The heat-resistance of PU as elastomer was significantly improved by incorporating of PA or PI of 10-20 wt % in PU. Life temperature designated as temperature at 10 wt % weight loss for 100 years was 110°C for PU-PA (80/20 wt%) and PU-PI (80/20 wt%).
マテリアルライフ学会の論文