Development of Thermally-resistant Gold Nanoparticles

概要

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Gold nanoparticles are expected as new materials for optical devices owing to their size-related properties. However, the typical gold nanoparticles surrounded by long-chain alkane thiols 1 (ligand molecules) are not tolerant of heating process because the interactions between the ligand molecules are not strong enough. In order to develop thermally-resistant gold nanoparticles, the authors focus on the functional groups which can form strong interactions between the ligand molecules such as hydrogen bonding and π-π stacking. In this study, 6 types of ligand molecules were synthesized and the thermal stability of the corresponding gold nanoparticles was evaluated by thermo gravimetry (TG) and differential scanning calorimetry (DSC). And, it was found that the thermal stability highly depended on the chemical structure of the ligand molecules. Since the amide group and the tolyl group which were introduced into the ligands had the ability to form intermolecular hydrogen bonding and π-π stacking, respectively. Therefore, the gold nanoparticle surrounded by amide-tolyl type ligand 3b was considered to be most thermally stable owing to the strong interactions between the functional groups.
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