高次構造制御による高熱伝導絶縁エポキシ樹脂

概要

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Present electrical devices have large calorific power, and improvement of heat dissipation has been a very important subject. In this paper, we developed the novel epoxy resins with increased thermal conductivity, the insufficiency of which has been a barrier to heat dissipation. The medium of thermal conduction for insulating resins is phonons. Phonon conduction depends on the crystallinity, since it is caused by a lattice vibration. The scattering of phonons happens on the interface of an amorphous structure. If there is a macroscopic amorphous structure so long as crystal structures exist on the microscopic level, we expected that high thermal conduction can be attained by reduced scattering of phonons through controlling the nano scale structure. Using an epoxy resin which has the mesogen structure would solve this problem because of easily carrying out an orientation with this structure. As a result, we confirm that thermal conductivities become higher with increasing amounts of mesogens. The epoxy resin (A) contains biphenyl mesogen, and the epoxy resin (B) contains even bigger mesogenic units. The thermal couductivity of the epoxy resin (A) was about two times higher than that of a conventional epoxy resin, and a much high value of five times was able to be attained in the case of the epoxy resin (B).
Japan Thermosetting Plastics Industry Associationの論文