粘弾性二層積層体の残留熱反り変形量の簡易評価法

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概要

• 論文の詳細を見る

• Electronic components, such as semiconductor devices are required for the optimum design of material properties, manufacturing process and structural dimensions when they become smaller and thinner. The finite element analysis and the viscoelastic analysis based on a linear viscoelastic theory are generally used to calculate the thermal stress and the warpage which generate in semiconductor devices. But these analysis methods are very complicated to calculate the thermal stress and the warpage of devices. For these reasons, in this paper, the simplified predicting formulae were derived by approximating the properties such as the modulus of longitudinal elasticity and thermal expansion coefficient into two domains, that is, the glassy zone and rubbery zone by the glass transition temperature of plastic materials. And it were derived by using the simple expressions based on the mechanics of materials in common use.Two-layered laminated bodies consisting of the epoxy resin and steel, printed wiring board were used for the experimental and theoretical studies of residual warpage. As a result, it was clarified that the residual warpage calculated by using the simplified prediction equations derived here was in good agreement with the experimental values and theoretical values, and these simplified prediction equations derived here were useful and available for optimum designing the electronic devices.

• 一般社団法人 日本機械学会の論文

著者

• 中村 省三

  Mechanical Systems Engineering, Graduate School of Science and Technology, Hiroshima Institute of Technology

関連論文

• 粘弾性二層積層体の残留熱反り変形量の簡易評価法

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