Correlativity with Properties of Surface Products and Chemical Mechanical Polishing Behavior

概要

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Correlation between the physical and chemical properties of the reaction products and dissolution behavior of copper in Cu-CMP slurry containing hydrogen peroxide was studied. The solubility behavior of the copper was evaluated for corrosion current density using Tafel plots with a rotating electrode that had an original load addition function. The physical and chemical properties of the product were evaluated using AES, XPS, and a nanoindenter. Numerous reaction products with low hardness were generated under the condition with a large corrosion current density under the load. With high corrosion current density, the reaction products consisted of Cu and the additives as the main constituents. In contrast, when the corrosion current density was low, copper oxide predominated. These results indicate that controlling the oxide generation rate and the reactive generation rate of the additive is important for increasing the rate and enabling both to coexist smoothly. Regarding enabling the coexistence of speed-up and flattening, the proportional control of the oxide generation rate and the generation rate of the reactant with the additive is important.