Material Technology of Conductive Wiring for Ink-jet Print
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概要
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New material technology for ink-jet printing has been studied. The relationship between new insulator ink and conductor ink was investigated. The fine pattern with highly adhesive performance was obtained by the simple process without any photomask. Experimental results revealed that the contact angle and the sliding angle are important parameters. The insulator ink was used for the insulating, surface leveling and material adjusting between the conductive traces. The new metallization process to fabricate the conductive copper trace was also investigated. The temperature of the process was below 200°C, which is suitable for organic substrates. The volume resistivity and pull-strength testing showed that the developed inks are applicable to fabricate highly conductive, smooth and straight patterns.
著者
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Kuroda Kyoko
High-performance Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
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Nakako Hideo
High-performance Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
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Inada Maki
High-performance Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
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Noudou Takaaki
High-performance Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
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Kumashiro Yasushi
High-performance Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
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Yamamoto Kazunori
High-performance Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.
関連論文
- Material Technology of Conductive Wiring for Ink-jet Print
- Development of Copper Materials and Processing for Printed Electronics