Silicon Microparticle Ejection Using Mist-jet Technology

概要

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The development of a novel mist-jet technology for ejecting a water mist containing silicon microparticles is described and demonstrated. A desired pattern can be drawn successfully on a large substrate using a silicon head specially designed for highly purified mist. The demonstration was performed using water containing silicon microparticles. The ejected mist droplet diameter was observed to be approximately 2.8 μm stimulated by an ultrasonic driving frequency of 5 MHz. The substrate was mobilized by a motorized stage at an optimum speed of 60 mm/s and a working temperature of 100°C for dehydration. The letters "BEANS" were drawn in silicon on a 200 mm × 200 mm glass substrate without any required surface treatment. A silicon-coated substrate was prepared by mist-jet ejection on a 10 mm × 10 mm area for thickness uniformity measurement using stylus surface profiler. The silicon pattern achieved uniformity to a standard deviation of 20 nm at a thickness of 380 nm.