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概要

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A process of plating copper on devitrified porcelain enamel printed circuit boards has been developed, the essential feature of which is the pretreatment of the porcelain surface with fluoride solution, catalysis with an organic solution, and electroless copper plating. A fully practical pull strength of 2-3kgf/mm2 was achieved for plated copper.This makes possible the copper, plating of through holes, formation of conductors and fine patterning with line widths of about 50μm width on porcelain enamel printed circuit boards.
社団法人表面技術協会の論文