無電解Ni-Sn-B合金めっきについて

概要

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Electroless nickel-tin-boron alloy deposits containing dimethylamine boron as a reducing agent were investigated to determine the effect of tin(IV) chloride on the deposition rate and on the tin and boron contents. The effect of the tin content of the deposits on their structure, resistivity, hardness and contact resistance was also studied. The basic bath composition was found to be nickel chloride 0.1mol/L, dimethylamine boron 0.051mol/L, sodium citrate 0.2mol/L and ammonium chloride 0.5mol/L. The pH was 7 (adjusted with NH4OH), the bath temperature was 90±1°C.The maximum tin content of the nickel-tin-boron deposits was found to be 18wt% and boron content decreased from 5.3wt% to 1.5wt% as tin content increased.Deposits with no tin content were amorphous, and crystallization was greater as tin content increased. The slope of the diffraction curve of Ni-Sn shifted to a low diffraction angle because of the formation of a solid phase.Hardness and electrical resistivity decreased as tin content increased.Contact resistance versus variable load was high for those deposits containing 16wt% tin, but low for all others.
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