無電解はんだめっきによる表面実装

概要

論文の詳細を見る
The higherdensities and fine pitch patters of recent printed circuit boards market, it is troublesome to prepare an adequate solder layer using such conventional mounting technologies as hot air leveling and solder paste treatment. Thus a new displacement-type plating process have been developed apply a thick layer of Pb-Sn alloy on PCBs having fine pitch patterns, as thicknesses of 10μm have been deposited within ca. 13 minutes The new deposit was resistant to oxidation, and its solderability after heattreatment at 200°C for 10 minutes was superior to that of layers made by conventional technique.
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