銅めっき応力測定法に関する基礎的研究 : 成長粒子およびすべり帯発生の繰返し速度依存性

概要

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In the copper electroplating method of stress analysis, frequency effects of cyclic stresses on the proper stress τp for grain growth and slip-initiation in the copper plating foil, and τs for slip-initiation in the copper foil were investigated within the range of 1∼15 kHz. The following results were obtained : (1) The proper stress τp increases and grown grains appear finely with an increase in frequency. (2) τp depends on strain rate remarkably as compared with τs. (3) This is due to the fact that the grain growth in the plating foil is dominated by both the test period and strain rate for the slip in crystals, while the slip-initiation in the copper foil is dominated only by the strain rate. (4) The relation between τp for grain growth and the test period is represented by one curve, regardless of the frequency within 1∼150 Hz.