銅めっき応力測定法に関する基礎的研究 : 成長粒子およびすべり帯発生の繰返し速度依存性
スポンサーリンク
概要
- 論文の詳細を見る
In the copper electroplating method of stress analysis, frequency effects of cyclic stresses on the proper stress τ<SUB>p</SUB> for grain growth and slip-initiation in the copper plating foil, and τ<SUB>s</SUB> for slip-initiation in the copper foil were investigated within the range of 1∼15 kHz. The following results were obtained : (1) The proper stress τ<SUB>p</SUB> increases and grown grains appear finely with an increase in frequency. (2) τ<SUB>p</SUB> depends on strain rate remarkably as compared with τ<SUB>s</SUB>. (3) This is due to the fact that the grain growth in the plating foil is dominated by both the test period and strain rate for the slip in crystals, while the slip-initiation in the copper foil is dominated only by the strain rate. (4) The relation between τ<SUB>p</SUB> for grain growth and the test period is represented by one curve, regardless of the frequency within 1∼150 Hz.
論文 | ランダム
- スペクトル・カラーの弁別閾について
- P29 東北日本弧、第四紀カルクアルカリ-デイサイト質溶岩に含まれる高フッ素苦鉄質包有物
- 東北日本弧,青麻火山の形成史と主成分化学組成
- P03 青麻火山噴出物の岩石学的特徴
- 臨床研究・症例報告 十二指腸Dieulafoy lesionを来した1小児例