Ni-Cu合金薄膜の歪-電気抵抗効果
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概要
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The aging effect of the electlical resistance of nickel, copper, and Ni-Cu films and resistance-strain characteristics (strain coefficient or gauge-factor K) are measured in a vacuum bell jar. These effects depend on the thickness of films. The gauge-factor K of relatively thick films tends to approach the value of the bulk one, and the resistance of films decreases with time just after the evaporation. The K-factot of a relatively thin film is larger than that of the bulk, and its resistance increases with time after the evaporation. The gauge-factor K of the films of intermediate thickness has a minimum value and the resistance varies gradually with time.<BR>The imperfections of the films produced by evaporation or adsorption of gases are seemed to affect on the electrical and mechanical properties of the films.
- 日本真空協会の論文
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