金属蒸着膜の内部応力

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概要

• 論文の詳細を見る

• Stress measurements in evaporated metallic films were carried out continuously during and after evaporation. Dependence of the stress upon film thickness, evaporation rate and substrate temperature were investigated. From these results, the origin of stress was discussed.<BR>For antimony films, it has been confirmed that the tensile stress is produced in the process of the crystallization of amorphous antimony. For metallic films such as Fe, Ni, Ag, Cu and Au films, it has been suggested that the recrystallization in films following after vacuum deposition plays an important role. The origin of the compressive stress, mainly observed in films evaporated onto heated substrates, however, has not been fully understood.

• 日本真空協会の論文

著者

• 堀越 弥

  東京大学工学部応用物理

• 田村 規子

  東京大学工学部応用物理

関連論文

• 金属蒸着膜の内部応力

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