Electrochemical and Surface Analytical Approach to Passive Film on 200 Series Stainless Steels Formed in Sulfuric Acid
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Electrochemical corrosion behaviour and chemical structure of the passive film of two newly developed austenitic stainless steels belonging to 200 series were studied in 1 M sulphuric acid (H2SO4). From polarization studies it was found that addition of Cu in the Cr–Mn–Ni stainless steel is beneficial in the passive range in terms of reduction in current density. X-ray photoelectron spectroscopy analysis of the passive film revealed enrichment of Cr ions on the surface irrespective of Ni and Mn content in the alloy. Mn in the passive film was relatively less considering its content in the alloy, but it increases with increase of Mn in the alloy. N compound was also observed in the passive film. Cu was present in the metallic as well as ionic form.
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- Electrochemical and Surface Analytical Approach to Passive Film on 200 Series Stainless Steels Formed in Sulfuric Acid
- Electrochemical and Surface Analytical Approach to Passive Film on 200 Series Stainless Steels Formed in Sulfuric Acid