Measurement of Strain and Stress Distributions in Structural Materials by Electron Moiré Method

スポンサーリンク

概要

• 論文の詳細を見る

• A method for measuring the strain and stress distributions in structural materials has been introduced. Fine model grids were fabricated by electron beam lithography, and an electron beam scan by a scanning electron microscope (SEM) was used as the master grid. Exposure of the electron beam scan onto the model grid in an SEM produced the electron beam moiré fringes of bright and dark parts caused by the different amounts of the secondary electrons per a primary electron. For demonstration, the micro-creep deformation of pure copper was observed. The creep strain distribution and the grain boundary sliding were analyzed. The residual strain and stress at the interface between a fiber and a matrix of a fiber reinforced plastic (FRP) were measured using the pushing-out test and this electron moiré method. Also, a non-uniform deformation around the boundary of 3-point bended laminated steel was observed and the strain distribution analyzed.

著者

• TANAKA Yoshihisa

  Composite Materials Group, Composite and Coating Materials Center, National Institute for Materials Science

• KAGAWA Yutaka

  Composite Materials Group, Composite and Coating Materials Center, National Institute for Materials Science

• KISHIMOTO Satoshi

  Composite Materials Group, Composite and Coating Materials Center, National Institute for Materials Science

• XING Yougming

  Department of Applied Mechanics, Inner Mongolia University of Technology

関連論文

• Industrial mass-production of mesoporous silica spherical particles by a spray-drying process : investigation of synthetic conditions
• Measurement of Strain and Stress Distributions in Structural Materials by Electron Moiré Method
• Molecular Dynamics Simulation of Thermal Conductivity of Silicon Thin Film
• Computation of Interfacial Thermal Resistance by Phonon Diffuse Mismatch Model
• Prediction of Thermal Conductivity of Composite Materials

スポンサーリンク