Microstructural Simulation of Three-Point Bending Test with Mo-Si-B Alloy at High Temperature: Sources of Strain Field Localization

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概要

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• Deformation behavior in three-point bending test of Mo-Si-B alloy was investigated by recourse to finite element analysis (FEA) with microstructure incorporated. This Mo-Si-B alloy consists of hard, brittle T2 (Mo5SiB2) phase embedded in soft matrix of Mo solid solution. The sample contains pre-crack configuration at the middle in order to study the effect of the second phase (T2 particles) onto a crack tip during the bending test. Various optical micrographs were scanned, digitized and meshed for FEA. It was found that strain localization from the second phase at the crack tip was interfered with that from the loading pin in three-point bending test. Such interference could be reduced by replacement with end moment loading, in order to identify sole strain localization effect from the second phase at the crack tip.

著者

• KUMAR K.

  Division of Engineering, Brown University

• Kumar K.

  Division Of Engineering Brown University

• ALUR Amruthavalli

  Division of Engineering, Brown University

• CHOLLACOOP Nuwong

  National Metals and Materials Technology Center (MTEC)

関連論文

• Effect of Anodic Dissolution and Hydrogen Absorption on Plastic Zone at Fatigue Crack Tip in Structural Steel
• Microstructural Simulation of Three-Point Bending Test with Mo-Si-B Alloy at High Temperature: Sources of Strain Field Localization
• Microstructural Finite Element Analysis of Mo-Si-B Alloy in High Temperature Applications

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