エポキシ系樹脂を用いたCMP用パッドの試作とその加工特性(第1報)

概要

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For the next generation LSI device, further highly efficient and multi-layer interconnection are required. To realize those purposes, CMP technology is serving as an essential role for polishing technology. Various pads are currently used for CMP, however, many problems such as how to reduce degradation of pads in the process of polishing or how to enhance polishing efficiency are left behind.To cope with those problems, experimental approaches (or studies) were conducted by using new pads of new materials comparing with the pads available now.As a result, higher efficient polishing characteristics were observed in the experiments using new pads than in the experiments using conventional pads and the measures how to work on the experiments have been acquired.
埼玉大学地域共同研究センターの論文