Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films
スポンサーリンク
概要
- 論文の詳細を見る
Etching pretreatment in H2SO4+CuSO4 solution was applied to magnetron sputter-deposited Al–Si alloy films formed on a glass plate to improve uniformity of Zn deposition in the double zincate process. In the etching process, a small amount of Cu was deposited on the alloy surface at a very high density to accompanying Al dissolution. These deposits acted as nucleation seeds for Zn deposition, resulting in uniform, fine and thin Zn layers on Al alloys in a zincate process. This effect was more prominent on Al alloys containing 2.0 or 2.6 atom % of Si than on those containing 0 or 1.0 atom % of Si. Such a discrepancy was caused by increased Cu deposition on Al–Si alloys with relatively high Si concentration.©2007 The Electrochemical Society
- The Electrochemical Societyの論文
The Electrochemical Society | 論文
- Direct Plating of Electroless Ni-P Layers on Sputter-Deposited Al-Ni Alloy Films
- High energy-density capacitor based on ammonium salt type ionic liquids and their mixing effect by propylene carbonate
- Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films
- Double Zincate Pretreatment of Sputter-Deposited Al Films
- Monitoring of Hydrogen Absorption into Titanium Using Resistometry